2-1734327-2 datasheet

Маркировка

2-1734327-2
Производитель

TE Connectivity
Описание

TE Connectivity 2-1734327-2 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Flash over Palladium Nickel Contact Plating, Mating Area, Thickness (?µm [??in]): 0.762 [30] Contact Termination Type: Surface Mount Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Led: Without Locating Post(s): With Locking Feature: Without Mount Location: Top Number Of Ports: 1 Number Of Positions: 5 Orientation: Right Angle Packaging Method: Tape & Reel Panel Ground: Without Pcb Mount Retention Type: SMT Hold Down Pcb Thickness, Recommended (mm [in]): 1.57 [0.062] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: A Shell Plating: Matte Tin Size: Mini Termination Method: Solder Usb-if Test Id Number (tid): Not Submitted For Testing
Количество страниц

4 шт.
Формат

PDF
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Размер файла

236,36 KB